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Before yesterdayNIST News

Biden-Harris Administration Awards Semiconductor Research Corporation Manufacturing Consortium Corporation $285M for New CHIPS Manufacturing USA Institute for Digital Twins, Headquartered in North Carolina

By: Joy Antwi
3 January 2025 at 07:00
Today, the U.S. Department of Commerce announced that CHIPS for America awarded the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) $285 million to establish and operate a CHIPS Manufacturing USA institute headquartered

FACT SHEET: U.S. Department of Commerce & U.S. Department of State Launch the International Network of AI Safety Institutes at Inaugural Convening in San Francisco

20 November 2024 at 07:00
San Francisco, California – Today the U.S. Department of Commerce and U.S. Department of State are co-hosting the inaugural convening of the International Network of AI Safety Institutes, a new global effort to advance the science of AI safety and

Biden-Harris Administration Announces Sunnyvale, CA as Expected Location for Second CHIPS for America R&D Flagship Facility

By: Joy Antwi
1 November 2024 at 08:00
Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced Sunnyvale, California as the expected location for the CHIPS for America Design and Collaboration Facility (DCF), an NSTC

Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the first CHIPS for America R&D Flagship Facility and Planned Site for the estimated $825 Million CHIPS for America EUV Accelerator

By: Joy Antwi
31 October 2024 at 08:00
Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility. The CHIPS for

Biden-Harris Administration Opens $100 million Competition to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

By: Joy Antwi
30 October 2024 at 08:00
Today, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI) and autonomous experimentation (AE) technologies to support the long-term viability of next

Biden-Harris Administration Announces Preliminary Terms with Hemlock Semiconductor to Significantly Expand U.S. Production Capacity of Semiconductor-Grade Polysilicon

By: Joy Antwi
21 October 2024 at 08:00
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $325 million in proposed direct funding under the

Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies

By: Joy Antwi
18 October 2024 at 08:00
Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) funded by the CHIPS and Science Act to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor

Biden-Harris Administration Announces Preliminary Terms with Infinera to Support Development of Semiconductor Technology Important for Communications and National Security

By: Joy Antwi
17 October 2024 at 08:00
Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act.

Biden-Harris Administration Announces Preliminary Terms with Wolfspeed to Solidify U.S. Technological Leadership in Silicon Carbide Manufacturing

By: Joy Antwi
15 October 2024 at 08:00
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed direct funding under the CHIPS and
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